1 36-00-04-005 ver. 1.0.0 aeroflex microelectronics solutions - hirel UT54ACS00E quadruple 2-input nand gates april 2015 www.aeroflex.com/logic datasheet features ? 0.6 m crh cmos process - latchup immune ? high speed ? low power consumption ? wide power supply operating range from 3.0v to 5.5v ? available qml q or v processes ? 14-lead flatpack ? UT54ACS00E - smd 5962-96512 description the UT54ACS00E is a performance and voltage enhanced ver - sion of the ut54acs00 quadruple, two-input nand gate. the ci rcui t performs the boolean functions y = a ? b or y = a + b in positive logic. the device is characterized over fu ll m ilitary temperature range of -55 c to +125 c. function table pinout 14-lead flatpack to p view logic symbol logic diagram inputs output a b y h h l l x h x l h v dd b4 a4 y4 b3 a3 y3 a1 b1 y1 a2 b2 y2 v ss 114 213 312 411 510 69 78 y1 (3) (6) y2 y3 (8) (11) y4 (1) a1 (2) b1 (4) a2 (5) b2 (9) a3 (10) b3 (12) a4 (13) b4 note: 1. logic symbol in accordance with ansi/ieee standard 91-1984 and iec publication 617-12. & b4 a4 y4 b3 a3 y3 a1 b1 y1 a2 b2 y2
2 36-00-04-005 ver. 1.0.0 aeroflex microelectronics solutions - hirel operational environment 1 notes: 1. logic will not latchup during radiation expo sure within the limits defined in the table. 2. device storage elements are immune to seu af fects. absolute maximum ratings 1 note: 1. stresses outside the listed absolute maxi mu m ratings may cause permanent damage to the device. this is a stress rating only, functional operation of the device at these or any other conditions beyond limits indicated in the operational s ections is not recommended. ex posure to absolute maximum ra ting conditions for extended periods may affect device reliability. 2. per mil-std-883, method 1012.1, section 3.4.1, p d = (t j(max) - t c(max) ) / jc recommended operating conditions parameter limit units total dose 1.0e6 rads(si) seu threshold 2 108 mev-cm 2 /mg sel threshold 120 mev-cm 2 /mg neutron fluence 1.0e14 n/cm 2 symbol parameter limit units v dd supply voltage -0.3 to 7.0 v v i/o voltage any pin -0.3 to v dd +0.3 v t stg storage temperature range -65 to +150 c t j maximum junction temperature +175 c t ls lead temperature (soldering 5 seconds) +300 c jc thermal resistance junction to case 15 c/w i i dc input current 10 ma p d 2 maximum package po wer dissipation permitted @ t c = +125 o c 3.2 w symbol parameter limit units v dd supply voltage 3.0 to 5.5 v v in input voltage any pin 0 to v dd v t c temperature range -55 to + 125 c
3 36-00-04-005 ver. 1.0.0 aeroflex microelectronics solutions - hirel dc electrical characteristi cs for the UT54ACS00E 7 ( v dd = 3.0v to 5.5v; v ss = 0v 6 ; -55 c < t c < +125 c) symbol description condition min max unit v il low-level input voltage 1 v dd from 3.0v to 5.5v 0.3v dd v v ih high-level input voltage 1 v dd from 3.0v to 5.5v 0.7v dd v i in input leakage current v in = v dd or v ss -1 1 a v ol1 low-level output voltage 3 i ol = 100 a 0.25 v v oh2 high-level output voltage 3 i oh = -100 a v dd - 0.25 v i os1 short-circuit output current 2 ,4 v o = v dd and v ss v dd from 4.5v to 5.5v -200 +200 ma i os2 short-circuit output current 2 ,4 v o = v dd and v ss v dd from 3.0v to 3.6v -100 +100 ma i ol1 low level output current 10 v in = v dd or v ss v ol = 0.4v v dd from 4.5v to 5.5v +8 ma i ol2 low level output current 10 v in = v dd or v ss v ol = 0.4v v dd from 3.0v to 3.6v +6 ma i oh1 high level output current 10 v in = v dd or v ss v oh = v dd -0.4v v dd from 4.5v to 5.5v -8 ma i oh2 high level output current 10 v in = v dd or v ss v oh = v dd -0.4v v dd from 3.0v to 3.6v -6 ma p total1 power dissipation 2, 8, 9 c l = 50pf v dd = 4.5v to 5.5v 1.0 mw/ mhz p total2 power dissipation 2, 8, 9 c l = 50pf v dd = 3.0v to 3.6v 0.5 mw/ mhz i ddq quiescent supply current v dd =5.5v 25 a c in input capacitance 5 ? = 1mhz v dd = 5v 15 pf c out output capacitance 5 ? = 1mhz v dd = 0v 15 pf
4 36-00-04-005 ver. 1.0.0 aeroflex microelectronics solutions - hirel notes: 1. functional tests are conducted in accordance with mil-std-883 with th e following input test conditions: v ih = v ih (min) + 20%, - 0%; v il = v il (max) + 0%, - 50%, as specified herein, for ttl, cmos, or schmitt compatible inputs. devices may be tested using any input voltage within the above specified range, but are guaranteed to v ih (min) and v il (max). 2. supplied as a design limit but not guaranteed or tested. 3. per mil-prf-38535, for current density 5. 0e5 amps/cm 2 , the maximum product of load capac itance (per output buffer) times fre quency should no t exceed 3,765pf/ mhz. 4. not more than one output may be shorted at a time f or maximum duration of one second. 5. capacitance measured for initial qualifica tion and whe n design changes may affect th e value. capacitance is measured between the designated terminal and v ss at frequency of 1mhz and a signal amplitude of 50 mv rms maximum. 6. maximum allowable relative shift equals 50mv. 7. for devices procured with a total ionizing dose tolerance guarantee, the post-i rradiation performance is guaranteed at 25c per mil-std-883 method 1019 condition a up to the maximum tid level procured. 8. power dissipation specifi ed per switching output. 9. power does not include power contributio n of any ttl output sink current. 10. guaranteed by characte riz ation, but not tested. ac electrical characteristics for the UT54ACS00E 2 ( v dd = 3.0v to 5.5v; v ss = 0v 1 ; -55 c < t c < +125 c) notes: 1. maximum allowable relative shift equals 50mv. 2. for devices procured with a total ionizing dose tolerance guarantee, the post-i rradiation performance is guaranteed at 25c per mil-std-883 method 1019 condition a up to the maximum tid level procured. symbol parameter condition v dd minimum maximum unit t plh input to yn c l = 50pf 4.5v to 5.5v 1 6 ns 3.0v to 3.6v 1 8 t phl input to yn c l = 50pf 4.5v to 5.5v 1 7 ns 3.0v to 3.6v 1 9
5 36-00-04-005 ver. 1.0.0 aeroflex microelectronics solutions - hirel packaging 1. all exposed metallized ar eas are gold plated over electroplated nickel per mil-prf-38535. 2. the lid is electri cally connected to v ss . 3. lead finishes are in accordance with mil-prf- 38535. 4. dimension symbol is in accordance with mil- prf-38533. 5. lead position and cola narity are not measured. figure 1. 14 lead flatpack
6 36-00-04-005 ver. 1.0.0 aeroflex microelectronics solutions - hirel ordering information: UT54ACS00E: smd drawing number: 96512 = UT54ACS00E device type: 02 = 1 rad(si)/sec package type: x = 14-lead ceramic botto m-brazed dual-in-line flatpack lead finish: (notes 1 & 2) a = solder c = gold x = optional 5962 ***** ** * * * * total dose: (note 3 and 4) r = 1e5 rads(si) f = 3e5 rads(si) g = 5e5 rads(si) h = 1e6 rads(si) 03 = 50 to 300 rads(si)/sec class designator: q = qml class q v = qml class v notes: 1. lead finish (a,c, or x) must be specified. 2. if an x is specified when ordering, part marking will match the lead finish and will be either a (solder) or c (gold). 3. total dose radiation must be specified when ordering. qml q and qml v not available without radiation hardening. for protot ype inquiries, contact factory. 4. device type 02 is only offered with a tid tolerance guarantee of 3e5 rads(si) or 1e6 rads(si) and is tested in accordance wi th mil-std-883 test method 1019 condition a and section 3.11.2. device type 03 is only offered with a tid tolerance guarantee of 1e5 rads(si), 3e5 rads(si), and 5e5 rads(si), and is tested in accordance w ith mil-std-883 test method 1019 condition a.
7 www.aeroflex.com info-ams@aeroflex.com our passion for performance is defined by three attributes represented by these three icons: solution-minded, performance-driven and customer-focused aeroflex colorado springs, inc., reserves the right to make changes to any products and services described herein at any time without notice. consult aeroflex or an authorized sales representative to verify that the informa- tion in this data sheet is current before using this product. aeroflex does not assume any responsibility or liability arising out of the application or use of any product or ser- vice described herein, except as expressly agreed to in writing by aeroflex; nor does the purchase, lease, or use of a product or service from aeroflex convey a license under any patent rights, copyrights, trademark rights, or any other of the intellectual rights of aeroflex or of third parties. this product is controlled for export under the u.s. department of commerce (doc). a license may be required prior to the export of this product from the united states. aeroflex colorado springs - datasheet definition advanced datasheet - product in development preliminary datasheet - shipping prototype datasheet - shipping qml & reduced hirel
8 36-00-04-005 ver. 1.0.0 aeroflex microelectronics solutions - hirel datasheet revision history revision date description of change march 2015 version 1.0.0 initial release of datasheet
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